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  • Hello Welcome To Suzhou Mango New Building Materials Co., Ltd!
    Sandwich panels
    Business Phone +86-13962231809
    XPS Sandwich Partition Walls
    Place of origin: Zhangjiagang,Jiangsu,China
    Brand Name: OEM service
    Certification: ISO9001,ISO14001,AS,CE
    Model Number:
    Minimum order Quantity: 100M2
    Price:
    Packaging Details: Pallets or in bulk
    Delivery Time: 15 days after the confirmation
    Payment Terms: T/T/LC at sight
    Supply Ability: Over 2 million square meters per year

    Description

    Insulation foam Laminated Mgo Panel ,also called Mgo SIP and Mgo Sandwich Panels. It is used insulation foam laminated  one or two pieces Mgo board, Insulation core can be Expanded Polystyrene(EPS) , Extruded Polystyrene(XPS),Polyisocyanurate Foam (PIR or PE) and so on.It could be directly used for exterior or interior wall ,No need to use Partition keel and insulation materials.

    Features:

    1,sound insulation and keep warm

    2,Green and environmental protection

    3,easy to install and combine discretionarily,it could be designed according to your requirement.

    4,install in local one time and save the cost of installation.

    Technical Info.

    Technical date for

      EPS foam board

    Density

     

    15-20

    Kg/m3

    Thermal conductivity,90 days,10

      

    ≤0.04

    W/mk

    Compressive strength at 10% deflection

     

    ≥100

      or yield,(Vertical)

    kPa

    Tensile strength

    kPa

    ≥100

    Coefficient 

    mm/mk

     ≤0.03

      of linear  thermal expansion

    Temperature 

     

     

      limits

    (-40,+80)

    Fire classification

    B1

     

     

     

    Technical data for

      XPS foam board

    Density

    Kg/m3

    25-40

    Thermal conductivity,90days,10 

    W/mk

          

    0.027-0.03

    Compressive strength at 10% deflection or

    kPa

          

         yield,(Vertical)

     300

    Tensile strength

    kPa

    ≤300

    Water absorption

    Vol-%

    ≤2

    Capillarity

    nil

     nil

    Coefficient of    linear thermal expansion

    mm/mk

    0.07

    Temperature limits

    (-40,+80)

     

     

     

    Technical data for

    PIR foam board

    Density

    Kg/m3

    35-45

    Thermal conductivity,90days,10      

    W/mk

          

    0.019-0.022

    Compressive strength at 10% deflection or

    kPa

          

         yield,(Vertical)

     ≤300

    Tensile strength

    kPa

    ≤300

    Water absorption

    Vol-%

     ≤2

    Coefficient of linear thermal expansion

    mm/mk

    0.004

    Temperature limits

    (-196,+160)

    Specification

    1. MGO board thickness: 3-20mm

    2. EPS core thickness: 20-75mm

    3. XPS core thickness: 20-50mm

    4. Max width: 1220mm; Max length: 3050mm

        Standard size 1200*2400mm,1200*2700mm,1200*3000mm.

    5. Connection can be Tongue & Groove, two or four sides closed or according to your design

    Applications:

    The flexibility of our building system is ideal for many applications including residential, industrial shops and warehouses, Ready to Move buildings and trailers, hotels, factories, aircraft hangars and apartments.Especiall it is used for prefabricated partition walls.

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    Online Service

    Contact us

    156622860

    what'app:13962231968

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